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9 Delamination of chip pad from encapsulating epoxy resin. © [2001]
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9 Delamination of chip pad from encapsulating epoxy resin. © [2001]
Polímeros: Ciência e Tecnologia (Polimeros)1st. issue, vol. 33, 2023 by Polímeros: Ciência e Tecnologia (Polimeros) - Issuu