A study of thermal cycling and radiation effects on indium and

The BTeV hybrid pixel detector is constructed of readout chips and sensor arrays which are developed separately. The detector is assembled by flip-chip mating of the two parts. This method requires the availability of highly reliable, reasonably low cost fine-pitch flip-chip attachment technology. We have tested the quality of two bump-bonding technologies; indium bumps (by Advanced Interconnect Technology Ltd. (AIT) of Hong Kong) and fluxless solder bumps (by MCNC in North Carolina, USA). The results have been presented elsewhere [1]. In this paper we describe tests we performed to further evaluate these technologies. We subjected 15 indium bump-bonded and 15 fluxless solder bump-bonded dummy detectors through a thermal cycle and then a dose of radiation to observe the effects of cooling, heating and radiation on bump-bonds. We also exercised the processes of HDI mounting and wire bonding to some of the dummy detectors to see the effect of these processes on bump bonds.

Frontiers Facile synthesis of lithium argyrodite Li5.5PS4.5Br1.5

Delafosse CHRISTIAN, Medical Doctor, Hospital Simone Veil, Montmorency, department of pneumology

Efficiency and Thermography in Cycling during a Graded Exercise Test

Frontiers Exposure to solar ultraviolet radiation establishes a

Mica provides clue to how water transports minerals

Stud bumping for flip chip - An alternate strategy

ACP - Quantifying snow darkening and atmospheric radiative effects

Use of CCD for reflow process design

Viability of Recycling Copper Indium Gallium Selenide (CIGS) in