Electroless UBM Formation Service｜Special Site of JX Metals

Introduction to application examples, advantages, and standard specifications of electroless UBM formation service

The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition - ScienceDirect

High-Purity Metals｜Special Site of JX Metals

Electroless UBM and solder bump [12, 17]

Effect of electric current stressing on mechanical performance of solders and solder joints: A review

Advanced under-bump metallization (UBM) with the AP&S e-less tool Vulcanio

Figure 1 from The impact of zincation on the electroless nickel UBM for low cost flip chip technology

Figure 1 from The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition

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Low α Tin/Bismuth for Soft Error Reduction｜Special Site of JX Metals