The dummy Flip package carrier, either substrates or lead frame provides the connection from the die to the exterior of the package.
A process flow of compression molding for dummy chip-on-wafer
PDF] A V-Band Beam-Steering Antenna on a Thin-Film Substrate With a Flip- Chip Interconnection
Flip Chip Component - Daisy Chain Bumped Test Die TopLine FC, FA10
Flip Chip CSP, Advanced Packaging
Development of Flip Chip Bonding Process on Silicon Interposer by
Flip Chips-Pac Tech Dummy Components
Dummy components display case brings training & presentations to life
Practical Dummy Components-Daisy-Chain Dummy Components
Figure 2 from Study on flip chip assembly of high density micro