Generic hybrid FPA with indium bump bonds [7].

Marcus H. Mendenhall's research works National Institute of Standards and Technology (NIST) and other places

II–VI Compound Semiconductor Avalanche Photodiodes for the

Generic hybrid FPA with indium bump bonds [7].

Fabrication of indium bumps for hybrid infrared focal plane array

US7001794B2 - Focal plane arrays in type II-superlattices - Google

Progress in Quantum Dot Infrared Photodetectors

Analysis on Structural Stress of 64 × 64 InSb IRFPAs with

a) Simulated absorption efficiency of the detector versus incident

Brian SIERAWSKI, Research Associate Professor, PhD Electrical Engineering, Vanderbilt University, TN, Vander Bilt, Institute for Space and Defence Electronics

CMOS Active Pixel Sensors

Cumulative distribution of the Cramér-Rao lower bound on the

Brian SIERAWSKI, Research Associate Professor, PhD Electrical Engineering, Vanderbilt University, TN, Vander Bilt, Institute for Space and Defence Electronics

Schematic drawing of the liquid nitrogen test stand. The germanium