SEM of insulated wire bonds (study A). Dark stripes on deformed ball is

Effect of welding parameters on resistance thermocompression

Comparison of Insulated with Bare Au Bonding Wire: HAZ Length

3D Structures Challenge Wire Bond Inspection

Micromachines, Free Full-Text

Micromachines, Free Full-Text

Reliability evaluation of thick Ag wire bonding on Ni pad for

Footprint Study of Ultrasonic Wedge-Bonding with Aluminum Wire

PDF) Copper Wire Bonding: A Review

Young-Kyu Song's research works

Micromachines, Free Full-Text

Sn–Bi–Ag Solder Enriched with Ta2O5 Nanoparticles for Flexible

Ball bond height versus ultrasound for (a) Au, (b) Cu-H, and (c

PF and TBF measured for various ultrasonic bonding times. T = 220

The Swager Group

Young-Kyu Song's research works