Wire bonding from chip to bonding pads and connection to leadframe.

PDF] Wire Bonding Using Offline Programming Method

Improve Wire Bond Capability and Reliability Through Use of Auxiliary Wires

FLIP CHIP TECHNOLOGY: ADVANCEMENTS IN PACKAGE ASSEMBLY, by Intech Technolgies

Epoxy die bonding - process control by optical surface characterization - Polytec

Effects of probe damage on wire bond integrity

Lead frame - Wikipedia

Ansforce

Reliable solutions for reducing wire bonding failures - Henniker Plasma

Technology Advances, Shortages Seen For Wire Bonders

What is Wire Bonding? - TWI

Video measuring system for real-time QC of lead frames packaging process - Nikon Industrial Metrology

Bonding Wire - an overview