The bond pad redistribution layer (polyimide 1) and the under bump

The bond pad redistribution layer (polyimide 1) and the under bump

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US6660624B2 - Method for reducing fluorine induced defects on a

Warren FLACK, Vice President, PhD

Materials, Free Full-Text

Illustration of polyimide or LCP substrate and solder assembly

Process integration of fine pitch Cu redistribution wiring and

redistribution layer (chip) (RDL)

Redistribution in wafer level chip size packaging technology for

PDF) Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with

Electromigration Performance Of Fine-Line Cu Redistribution Layer

Micromachines, Free Full-Text

PDF) Redistribution layers (RDLs) for 2.5D/3D IC integration

Process integration of fine pitch Cu redistribution wiring and

CN111108144A - Curable polyimide - Google Patents

Optimizing Chiplet Packaging for Complex Applications - QP

Warren FLACK, Vice President, PhD